Reliability of Microtechnology Interconnects, Devices and Systems /

Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general fail...

Πλήρης περιγραφή

Λεπτομέρειες βιβλιογραφικής εγγραφής
Κύριοι συγγραφείς: Liu, Johan (Συγγραφέας), Salmela, Olli (Συγγραφέας), Sarkka, Jussi (Συγγραφέας), Morris, James E. (Συγγραφέας), Tegehall, Per-Erik (Συγγραφέας), Andersson, Cristina (Συγγραφέας)
Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
Γλώσσα:English
Έκδοση: New York, NY : Springer New York, 2011.
Έκδοση:1.
Θέματα:
Διαθέσιμο Online:Full Text via HEAL-Link
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100 1 |a Liu, Johan.  |e author. 
245 1 0 |a Reliability of Microtechnology  |h [electronic resource] :  |b Interconnects, Devices and Systems /  |c by Johan Liu, Olli Salmela, Jussi Sarkka, James E. Morris, Per-Erik Tegehall, Cristina Andersson. 
250 |a 1. 
264 1 |a New York, NY :  |b Springer New York,  |c 2011. 
300 |a XIII, 204 p.  |b online resource. 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
347 |a text file  |b PDF  |2 rda 
505 0 |a Introduction to Reliability and its Importance -- Reliability Metrology -- General Failure Mechanisms of Microsystems -- Solder and Conductive Adhesive Joint Reliability -- Accelerated Testing -- Reliability Design for Manufacturability -- Component Reliability -- System Level Reliability -- Reliability and Quality Management of Microsystem -- Experimental Tools for Reliability Analysis. 
520 |a Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail. The book also: Discusses the general failure mechanisms of microsystems on a component level Offers comprehensive coverage of solder joint reliability at the microsystems level Analyzes�quality issues and manufacturing at the microsystems level Reliability of Microtechnology is an ideal volume for researchers and professional engineers working in reliability and manufacturing. The book also includes exercises and detailed solutions at the end of each chapter. 
650 0 |a Engineering. 
650 0 |a Nanotechnology. 
650 0 |a Quality control. 
650 0 |a Reliability. 
650 0 |a Industrial safety. 
650 0 |a Electronics. 
650 0 |a Microelectronics. 
650 0 |a Optical materials. 
650 0 |a Electronic materials. 
650 1 4 |a Engineering. 
650 2 4 |a Electronics and Microelectronics, Instrumentation. 
650 2 4 |a Optical and Electronic Materials. 
650 2 4 |a Quality Control, Reliability, Safety and Risk. 
650 2 4 |a Nanotechnology and Microengineering. 
700 1 |a Salmela, Olli.  |e author. 
700 1 |a Sarkka, Jussi.  |e author. 
700 1 |a Morris, James E.  |e author. 
700 1 |a Tegehall, Per-Erik.  |e author. 
700 1 |a Andersson, Cristina.  |e author. 
710 2 |a SpringerLink (Online service) 
773 0 |t Springer eBooks 
776 0 8 |i Printed edition:  |z 9781441957597 
856 4 0 |u http://dx.doi.org/10.1007/978-1-4419-5760-3  |z Full Text via HEAL-Link 
912 |a ZDB-2-ENG 
950 |a Engineering (Springer-11647)