APA (7th ed.) Citation

SpringerLink (Online service), Tong, H., Lai, Y., & Wong, C. (2013). Advanced Flip Chip Packaging. Springer US : Imprint: Springer.

Chicago Style (17th ed.) Citation

SpringerLink (Online service), Ho-Ming Tong, Yi-Shao Lai, and C.P Wong. Advanced Flip Chip Packaging. Boston, MA: Springer US : Imprint: Springer, 2013.

MLA (8th ed.) Citation

SpringerLink (Online service), et al. Advanced Flip Chip Packaging. Springer US : Imprint: Springer, 2013.