Advanced Flip Chip Packaging

• Corporate Author: SpringerLink (Online service)
• Other Authors: Tong, Ho-Ming (Editor), Lai, Yi-Shao (Editor), Wong, C.P (Editor)
• Format: Electronic eBook
• Language: English
• Published: Boston, MA : Springer US : Imprint: Springer, 2013.
• Subjects: Engineering.; Electronics.; Microelectronics.; Electronic circuits.; Optical materials.; Electronic materials.; Electronics and Microelectronics, Instrumentation.; Circuits and Systems.; Optical and Electronic Materials.

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for f...