Advanced Flip Chip Packaging

• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Άλλοι συγγραφείς: Tong, Ho-Ming (Επιμελητής έκδοσης), Lai, Yi-Shao (Επιμελητής έκδοσης), Wong, C.P (Επιμελητής έκδοσης)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Boston, MA : Springer US : Imprint: Springer, 2013.
• Θέματα: Engineering.; Electronics.; Microelectronics.; Electronic circuits.; Optical materials.; Electronic materials.; Electronics and Microelectronics, Instrumentation.; Circuits and Systems.; Optical and Electronic Materials.

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for f...

Πίνακας περιεχομένων:

• Flip Chip Technology Overview and Early Beginnings
• Technology Trends of Flip Chip
• Bumping Technologies
• Flip-Chip Interconnections: Past, Present and Future
• Underfill
• Conductive Adhesives for Flip Chip Applications
• Enabling Substrate Technologies: Past, Present and Future
• IC-Package-System Integrated Design
• Thermal Management of Flip Chip Packages
• Thermo-Mechanical Reliability in Flip Chip Packages
•  Interfacial Reactions and Electromigration in Flip-Chip Solder Joints.