Constrained Deformation of Materials Devices, Heterogeneous Structures and Thermo-Mechanical Modeling /

"Constrained Deformation of Materials: Devices, Heterogeneous Structures and Thermo-Mechanical Modeling" presents an in-depth look at the mechanical analyses and modeling of advanced small-scale structures and heterogeneous material systems. Mechanical deformations in thin films and miniat...

Πλήρης περιγραφή

Λεπτομέρειες βιβλιογραφικής εγγραφής
Κύριος συγγραφέας: Shen, Y.-L (Συγγραφέας)
Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
Γλώσσα:English
Έκδοση: Boston, MA : Springer US : Imprint: Springer, 2010.
Θέματα:
Διαθέσιμο Online:Full Text via HEAL-Link
LEADER 02995nam a22005295i 4500
001 978-1-4419-6312-3
003 DE-He213
005 20151204145151.0
007 cr nn 008mamaa
008 100806s2010 xxu| s |||| 0|eng d
020 |a 9781441963123  |9 978-1-4419-6312-3 
024 7 |a 10.1007/978-1-4419-6312-3  |2 doi 
040 |d GrThAP 
050 4 |a TJ1-1570 
072 7 |a TGB  |2 bicssc 
072 7 |a TEC009070  |2 bisacsh 
082 0 4 |a 621  |2 23 
100 1 |a Shen, Y.-L.  |e author. 
245 1 0 |a Constrained Deformation of Materials  |h [electronic resource] :  |b Devices, Heterogeneous Structures and Thermo-Mechanical Modeling /  |c by Y.-L. Shen. 
264 1 |a Boston, MA :  |b Springer US :  |b Imprint: Springer,  |c 2010. 
300 |a IX, 281 p.  |b online resource. 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
347 |a text file  |b PDF  |2 rda 
505 0 |a Mechanics Preliminaries -- Thin Continuous Films -- Patterned Films in Micro-devices -- Electronic Packaging Structures -- Heterogeneous Materials -- Challenges and Outlook. 
520 |a "Constrained Deformation of Materials: Devices, Heterogeneous Structures and Thermo-Mechanical Modeling" presents an in-depth look at the mechanical analyses and modeling of advanced small-scale structures and heterogeneous material systems. Mechanical deformations in thin films and miniaturized materials, commonly found in microelectronic devices and packages, MEMS, nanostructures and composite and multi-phase materials, are heavily influenced by the external or internal physical confinement. A continuum mechanics-based approach is used, together with discussions on micro-mechanisms, to treat the subject in a systematic manner under the unified theme. Readers will find valuable information on the proper application of thermo-mechanics in numerical modeling as well as in the interpretation and prediction of physical material behavior, along with many case studies. Additionally, particular attention is paid to practical engineering relevance. Thus real-life reliability issues are discussed in detail to serve the needs of researchers and engineers alike. 
650 0 |a Engineering. 
650 0 |a Mechanics. 
650 0 |a Continuum mechanics. 
650 0 |a Mechanical engineering. 
650 0 |a Industrial engineering. 
650 0 |a Production engineering. 
650 0 |a Materials  |x Surfaces. 
650 0 |a Thin films. 
650 1 4 |a Engineering. 
650 2 4 |a Mechanical Engineering. 
650 2 4 |a Industrial and Production Engineering. 
650 2 4 |a Mechanics. 
650 2 4 |a Continuum Mechanics and Mechanics of Materials. 
650 2 4 |a Surfaces and Interfaces, Thin Films. 
710 2 |a SpringerLink (Online service) 
773 0 |t Springer eBooks 
776 0 8 |i Printed edition:  |z 9781441963116 
856 4 0 |u http://dx.doi.org/10.1007/978-1-4419-6312-3  |z Full Text via HEAL-Link 
912 |a ZDB-2-ENG 
950 |a Engineering (Springer-11647)