Reliability Physics and Engineering Time-To-Failure Modeling /

• Κύριος συγγραφέας: McPherson, J.W (Συγγραφέας)
• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Boston, MA : Springer US : Imprint: Springer, 2010.
• Θέματα: Engineering.; Mechanical engineering.; Quality control.; Reliability.; Industrial safety.; Electronics.; Microelectronics.; Quality Control, Reliability, Safety and Risk.; Electronics and Microelectronics, Instrumentation.; Mechanical Engineering.

 Reliability Physics and Engineering provides critically important information that is needed for designing and building reliable cost-effective products. Key features include: • Materials/Device Degradation • Degradation Kinetics • Time-To-Failure Modeling • Statistical Tools • Failure-Rate Modeling • Accelerated Testing • Ramp-To-Failure Testing • Important Failure Mechanisms for Integrated Circuits • Important Failure Mechanisms for Mechanical Components • Conversion of Dynamical Stresses into Static Equivalents • Small Design Changes Producing Major Reliability Improvements This textbook includes numerous example problems with solutions. Also, exercise problems along with answers are included at the end of each chapter. Reliability Physics and Engineering can be a useful resource for students, engineers and materials scientists. 

 Materials and Device Degradation -- From Material/Device Degradation to Time-To-Failure -- Time-To-Failure Modeling -- Gaussian Statistics — An Overview -- Time-To-Failure Statistics -- Failure Rate Modeling -- Accelerated Degradation -- Acceleration Factor Modeling -- Ramp-to-Failure Testing -- Time-To-Failure Models for Selected Failure Mechanisms in Integrated Circuits -- Time-To-Failure Models for Selected Failure Mechanisms in Mechanical Engineering -- Conversion of Dynamical Stresses into Effective Static Values -- Increasing the Reliability of Device/Product Designs -- Erratum to: Materials and Device Degradation.