Coupled Data Communication Techniques for High-Performance and Low-Power Computing

Designers of next-generation high-performance computer systems face a host of technical challenges. For the past several decades, rising clock frequencies and increased chip integration have fueled the growth of computer performance. Now these trends have slowed: power and complexity constrains furt...

Πλήρης περιγραφή

Λεπτομέρειες βιβλιογραφικής εγγραφής
Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
Άλλοι συγγραφείς: Ho, Ron (Επιμελητής έκδοσης), Drost, Robert (Επιμελητής έκδοσης)
Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
Γλώσσα:English
Έκδοση: Boston, MA : Springer US, 2010.
Σειρά:Integrated Circuits and Systems,
Θέματα:
Διαθέσιμο Online:Full Text via HEAL-Link
Πίνακας περιεχομένων:
  • to Coupled Data Technologies
  • Overview of 3D Technologies
  • Power delivery, signaling and cooling for 2D and 3D integrated systems
  • Coupled Data Technologies
  • Capacitive Coupled Communication
  • Inductive Coupled Communications
  • Use of AC Coupled Interconnect in Contactless Packaging
  • Enabling Coupled Data Technologies
  • Aligning chips face-to-face for dense capacitive communication
  • Extending Data Coupling Technologies
  • Delivering On-chip Bandwidth Off-chip and Out-of-box with Proximity and Optical Communication
  • AC Coupled Wireless Power Delivery.