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03211nam a22004815i 4500 |
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978-1-4419-7618-5 |
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DE-He213 |
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20151204152057.0 |
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101109s2011 xxu| s |||| 0|eng d |
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|a 9781441976185
|9 978-1-4419-7618-5
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|a 10.1007/978-1-4419-7618-5
|2 doi
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|a TK7888.4
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|a TJFC
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|a TEC008010
|2 bisacsh
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|a 621.3815
|2 23
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|a 3D Integration for NoC-based SoC Architectures
|h [electronic resource] /
|c edited by Abbas Sheibanyrad, Frédéric Pétrot, Axel Jantsch.
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|a New York, NY :
|b Springer New York,
|c 2011.
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|a X, 278 p.
|b online resource.
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|a text
|b txt
|2 rdacontent
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|a computer
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|a online resource
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|a text file
|b PDF
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|a Integrated Circuits and Systems,
|x 1558-9412
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|a Three-Dimensional Integration of Integrated Circuits - an Introduction -- The Promises and Limitation of 3-D Integration -- Testing 3D Stacked ICs Containing Through-Silicon Vias -- Design and Computer Aided Design of 3DIC -- Physical Analysis of NoC Topologies for 3-D Integrated Systems -- Three-Dimensional Networks-on-Chip: Performance Evaluation -- Asynchronous 3D-NoCs -- Design of Application-Specific 3D Networks-on-Chip Architectures -- 3D Network on Chip Topology Synthesis: Designing Custom Topologies for Chip Stacks -- 3-D NoC on Inductive Wireless Interconnect -- Influence of Stacked 3D Memory/Cache architectures on GPUs.
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|a Back Cover Copy SERIES: Integrated Circuits and Systems 3D-Integration for NoC-based SoC Architectures by: (Editors) Abbas Sheibanyrad Frédéric Petrot Axel Janstch This book investigates on the promises, challenges, and solutions for the 3D Integration (vertically stacking) of embedded systems connected via a network on a chip. It covers the entire architectural design approach for 3D-SoCs. 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures have emerged as topics critical for current R&D leading to a broad range of products. This book presents a comprehensive, system-level overview of three-dimensional architectures and micro-architectures. •Presents a comprehensive, system-level overview of three-dimensional architectures and micro-architectures; •Covers the entire architectural design approach for 3D-SoCs; •Includes state-of-the-art treatment of 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures.
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650 |
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|a Engineering.
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650 |
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|a Software engineering.
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|a Electronic circuits.
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|a Engineering.
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|a Circuits and Systems.
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|a Software Engineering.
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700 |
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|a Sheibanyrad, Abbas.
|e editor.
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700 |
1 |
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|a Pétrot, Frédéric.
|e editor.
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700 |
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|a Jantsch, Axel.
|e editor.
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710 |
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|a SpringerLink (Online service)
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|t Springer eBooks
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776 |
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|i Printed edition:
|z 9781441976178
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830 |
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|a Integrated Circuits and Systems,
|x 1558-9412
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856 |
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|u http://dx.doi.org/10.1007/978-1-4419-7618-5
|z Full Text via HEAL-Link
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912 |
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|a ZDB-2-ENG
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950 |
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|a Engineering (Springer-11647)
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