Παραπομπή σε μορφή APA (7η εκδ.)

Tong, X. C. (2011). Advanced Materials for Thermal Management of Electronic Packaging. Springer New York : Imprint: Springer.

Παραπομπή σε μορφή Chicago (17η εκδ.)

Tong, Xingcun Colin. Advanced Materials for Thermal Management of Electronic Packaging. New York, NY: Springer New York : Imprint: Springer, 2011.

Παραπομπή σε μορφή MLA (8th εκδ.)

Tong, Xingcun Colin. Advanced Materials for Thermal Management of Electronic Packaging. Springer New York : Imprint: Springer, 2011.