APA (7th ed.) Citation

Tong, X. C. (2011). Advanced Materials for Thermal Management of Electronic Packaging. Springer New York : Imprint: Springer.

Chicago Style (17th ed.) Citation

Tong, Xingcun Colin. Advanced Materials for Thermal Management of Electronic Packaging. New York, NY: Springer New York : Imprint: Springer, 2011.

MLA (8th ed.) Citation

Tong, Xingcun Colin. Advanced Materials for Thermal Management of Electronic Packaging. Springer New York : Imprint: Springer, 2011.