Advanced Materials for Thermal Management of Electronic Packaging

• Main Author: Tong, Xingcun Colin (Author)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic eBook
• Language: English
• Published: New York, NY : Springer New York : Imprint: Springer, 2011.
• Series: Springer Series in Advanced Microelectronics, 30
• Subjects: Physics.; Electronic circuits.; Thermodynamics.; Heat engineering.; Heat transfer.; Mass transfer.; Electronics.; Microelectronics.; Optical materials.; Electronic materials.; Electronic Circuits and Devices.; Optical and Electronic Materials.; Engineering Thermodynamics, Heat and Mass Transfer.; Electronics and Microelectronics, Instrumentation.

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, mo...