Interfacial Compatibility in Microelectronics Moving Away from the Trial and Error Approach /

Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult tas...

Πλήρης περιγραφή

Λεπτομέρειες βιβλιογραφικής εγγραφής
Κύριοι συγγραφείς: Laurila, Tomi (Συγγραφέας), Vuorinen, Vesa (Συγγραφέας), Paulasto-Kröckel, Mervi (Συγγραφέας), Turunen, Markus (Συγγραφέας), Mattila, Toni T. (Συγγραφέας), Kivilahti, Jorma (Συγγραφέας)
Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
Γλώσσα:English
Έκδοση: London : Springer London, 2012.
Σειρά:Microsystems,
Θέματα:
Διαθέσιμο Online:Full Text via HEAL-Link
LEADER 03489nam a22005655i 4500
001 978-1-4471-2470-2
003 DE-He213
005 20151125221803.0
007 cr nn 008mamaa
008 120109s2012 xxk| s |||| 0|eng d
020 |a 9781447124702  |9 978-1-4471-2470-2 
024 7 |a 10.1007/978-1-4471-2470-2  |2 doi 
040 |d GrThAP 
050 4 |a T174.7 
072 7 |a TDPB  |2 bicssc 
072 7 |a TEC027000  |2 bisacsh 
082 0 4 |a 620.5  |2 23 
100 1 |a Laurila, Tomi.  |e author. 
245 1 0 |a Interfacial Compatibility in Microelectronics  |h [electronic resource] :  |b Moving Away from the Trial and Error Approach /  |c by Tomi Laurila, Vesa Vuorinen, Mervi Paulasto-Kröckel, Markus Turunen, Toni T. Mattila, Jorma Kivilahti. 
264 1 |a London :  |b Springer London,  |c 2012. 
300 |a X, 218 p.  |b online resource. 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
347 |a text file  |b PDF  |2 rda 
490 1 |a Microsystems,  |x 1389-2134 
505 0 |a Introduction: Away from trial and error methods -- Materials and interfaces in Microsystems -- Introduction to mechanics of materials -- Introduction to thermodynamic-kinetic method -- Interfacial adhesion in polymer systems -- Evolution of different types of interfacial structures. 
520 |a Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the “traditional” method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced. In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes: •solutions to several common reliability issues in microsystem technology, •methods to understand and predict failure mechanisms at interfaces between dissimilar materials and •an approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA. Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike.    . 
650 0 |a Engineering. 
650 0 |a Nanotechnology. 
650 0 |a Optical materials. 
650 0 |a Electronic materials. 
650 0 |a Materials  |x Surfaces. 
650 0 |a Thin films. 
650 1 4 |a Engineering. 
650 2 4 |a Nanotechnology and Microengineering. 
650 2 4 |a Surfaces and Interfaces, Thin Films. 
650 2 4 |a Optical and Electronic Materials. 
700 1 |a Vuorinen, Vesa.  |e author. 
700 1 |a Paulasto-Kröckel, Mervi.  |e author. 
700 1 |a Turunen, Markus.  |e author. 
700 1 |a Mattila, Toni T.  |e author. 
700 1 |a Kivilahti, Jorma.  |e author. 
710 2 |a SpringerLink (Online service) 
773 0 |t Springer eBooks 
776 0 8 |i Printed edition:  |z 9781447124696 
830 0 |a Microsystems,  |x 1389-2134 
856 4 0 |u http://dx.doi.org/10.1007/978-1-4471-2470-2  |z Full Text via HEAL-Link 
912 |a ZDB-2-ENG 
950 |a Engineering (Springer-11647)