Lead Free Solder Mechanics and Reliability /

• Κύριος συγγραφέας: Pang, John Hock Lye (Συγγραφέας)
• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: New York, NY : Springer New York, 2012.
• Θέματα: Engineering.; Continuum mechanics.; Electronics.; Microelectronics.; Electronic circuits.; Optical materials.; Electronic materials.; Electronics and Microelectronics, Instrumentation.; Optical and Electronic Materials.; Continuum Mechanics and Mechanics of Materials.; Circuits and Systems.

Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free sol...

Πίνακας περιεχομένων:

• Introduction
• Theory on Mechanics of Solder Materials.-Mechanical Properties and Constitutive Models
• Fatigue Life Prediction Models
• Finite Element Analysis and Design-For-Reliability
• Thermo-Mechanical Reliability Test and Analysis
• Dynamic Mechanical Reliability Test and Analysis
• Thermal Cycling Aging Effects on Board-Level Drop Test Result.