APA (7th ed.) Citation

Liu, Y. (2012). Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling. Springer New York : Imprint: Springer.

Chicago Style (17th ed.) Citation

Liu, Yong. Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling. New York, NY: Springer New York : Imprint: Springer, 2012.

MLA (8th ed.) Citation

Liu, Yong. Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling. Springer New York : Imprint: Springer, 2012.