Παραπομπή σε μορφή APA (7η εκδ.)

Liu, Y. (2012). Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling. Springer New York : Imprint: Springer.

Παραπομπή σε μορφή Chicago (17η εκδ.)

Liu, Yong. Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling. New York, NY: Springer New York : Imprint: Springer, 2012.

Παραπομπή σε μορφή MLA (8th εκδ.)

Liu, Yong. Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling. Springer New York : Imprint: Springer, 2012.