Power Electronic Packaging Design, Assembly Process, Reliability and Modeling /

• Κύριος συγγραφέας: Liu, Yong (Συγγραφέας)
• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: New York, NY : Springer New York : Imprint: Springer, 2012.
• Θέματα: Engineering.; Solid state physics.; Spectroscopy.; Microscopy.; Electronics.; Microelectronics.; Electronic circuits.; Power electronics.; Power Electronics, Electrical Machines and Networks.; Electronics and Microelectronics, Instrumentation.; Solid State Physics.; Spectroscopy and Microscopy.; Circuits and Systems.

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, a...