Power Electronic Packaging Design, Assembly Process, Reliability and Modeling /

• Main Author: Liu, Yong (Author)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic eBook
• Language: English
• Published: New York, NY : Springer New York : Imprint: Springer, 2012.
• Subjects: Engineering.; Solid state physics.; Spectroscopy.; Microscopy.; Electronics.; Microelectronics.; Electronic circuits.; Power electronics.; Power Electronics, Electrical Machines and Networks.; Electronics and Microelectronics, Instrumentation.; Solid State Physics.; Spectroscopy and Microscopy.; Circuits and Systems.

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, a...