Power Electronic Packaging Design, Assembly Process, Reliability and Modeling /

• Main Author: Liu, Yong (Author)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic eBook
• Language: English
• Published: New York, NY : Springer New York : Imprint: Springer, 2012.
• Subjects: Engineering.; Solid state physics.; Spectroscopy.; Microscopy.; Electronics.; Microelectronics.; Electronic circuits.; Power electronics.; Power Electronics, Electrical Machines and Networks.; Electronics and Microelectronics, Instrumentation.; Solid State Physics.; Spectroscopy and Microscopy.; Circuits and Systems.

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, a...

Table of Contents:

• Challenges of Power Electronic Packaging
• Power Package Electrical Isolation Design
• Discrete Power MOSFET Package Design and Analysis
• Power IC Packaging Design and Analysis
• Power Module/SIP/3D/Stack/Embedded Packaging Design and Considerations
• Thermal Management, Design and Cooling for Power Electronics
• Material Characterization for Power Electronics Packaging
• Power Package Typical Assembly Process
• Power Packaging Typical Reliability and Tests
• Power Packaging Modeling and Challenges
• Power Package Thermal and Mechanical Co-Design Simulation Automation
• Power Package Electrical and Multiple Physics Simulation.  .