Design for Manufacturability From 1D to 4D for 90–22 nm Technology Nodes /
This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes. It is a valuable guide for layout designers, packaging engineers a...
| Main Author: | Balasinski, Artur (Author) |
|---|---|
| Corporate Author: | SpringerLink (Online service) |
| Format: | Electronic eBook |
| Language: | English |
| Published: |
New York, NY :
Springer New York : Imprint: Springer,
2014.
|
| Subjects: | |
| Online Access: | Full Text via HEAL-Link |
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