Design for Manufacturability From 1D to 4D for 90–22 nm Technology Nodes /

• Main Author: Balasinski, Artur (Author)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic eBook
• Language: English
• Published: New York, NY : Springer New York : Imprint: Springer, 2014.
• Subjects: Engineering.; Quality control.; Reliability.; Industrial safety.; Electronics.; Microelectronics.; Electronic circuits.; Circuits and Systems.; Electronics and Microelectronics, Instrumentation.; Quality Control, Reliability, Safety and Risk.

This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes.  It is a valuable guide for layout designers, packaging engineers a...

Table of Contents:

• Preface
• Classic DfM: from 2D to 3D
• DfM at 28 nm and Beyond
• New DfM Domain: Stress Effects
• Conclusions and Future Work.