Design for Manufacturability From 1D to 4D for 90–22 nm Technology Nodes /

Design for Manufacturability From 1D to 4D for 90–22 nm Technology Nodes /

This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes.  It is a valuable guide for layout designers, packaging engineers a...

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Bibliographic Details
Main Author: Balasinski, Artur (Author)
Corporate Author: SpringerLink (Online service)
Format: Electronic eBook
Language:English
Published: New York, NY : Springer New York : Imprint: Springer, 2014.
Subjects:
Engineering.
Quality control.
Reliability.
Industrial safety.
Electronics.
Microelectronics.
Electronic circuits.
Circuits and Systems.
Electronics and Microelectronics, Instrumentation.
Quality Control, Reliability, Safety and Risk.
Online Access:Full Text via HEAL-Link

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ΒΚΠ - Πατρα: ALFd

Holdings details from ΒΚΠ - Πατρα: ALFd
Call Number: 330.01 BAU
Copy 1 Available

ΒΚΠ - Πατρα: BSC

Holdings details from ΒΚΠ - Πατρα: BSC
Call Number: 330.01 BAU
Copy 2 Available
Copy 3 Available

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