Advanced Thermal Management Materials

Advanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This...

Πλήρης περιγραφή

Λεπτομέρειες βιβλιογραφικής εγγραφής
Κύριοι συγγραφείς: Jiang, Guosheng (Συγγραφέας), Diao, Liyong (Συγγραφέας), Kuang, Ken (Συγγραφέας)
Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
Γλώσσα:English
Έκδοση: New York, NY : Springer New York : Imprint: Springer, 2013.
Θέματα:
Διαθέσιμο Online:Full Text via HEAL-Link
Πίνακας περιεχομένων:
  • Introduction to Thermal Management in Microelectronics Packaging
  • Requirements of Thermal Management Materials
  • Overview of Traditional Thermal Management Materials.-Development of Advanced Thermal Management Materials
  • Properties of WCu, MoCu, Cu/MoCu/Cu High Performance Heat Sink Materials and Manufacturing Technologies
  • Novel Methods for Manufacturing of W85-Cu Heat Sinks for Electronic Packaging Applications
  •  Improved Manufacturing Process of Cu/Mo70-Cu/Cu Composite Heat Sinks for Electronic Packaging Applications
  • Al/SiC Thermal Management Materials
  • Understanding of Laser, Laser diodes, Laser diode packaging and its relationship to Tungsten Copper
  • Future Trend of Advanced Thermal Management Materials.