Advanced Thermal Management Materials
Advanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This...
Κύριοι συγγραφείς: | , , |
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Συγγραφή απο Οργανισμό/Αρχή: | |
Μορφή: | Ηλεκτρονική πηγή Ηλ. βιβλίο |
Γλώσσα: | English |
Έκδοση: |
New York, NY :
Springer New York : Imprint: Springer,
2013.
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Θέματα: | |
Διαθέσιμο Online: | Full Text via HEAL-Link |
Πίνακας περιεχομένων:
- Introduction to Thermal Management in Microelectronics Packaging
- Requirements of Thermal Management Materials
- Overview of Traditional Thermal Management Materials.-Development of Advanced Thermal Management Materials
- Properties of WCu, MoCu, Cu/MoCu/Cu High Performance Heat Sink Materials and Manufacturing Technologies
- Novel Methods for Manufacturing of W85-Cu Heat Sinks for Electronic Packaging Applications
- Improved Manufacturing Process of Cu/Mo70-Cu/Cu Composite Heat Sinks for Electronic Packaging Applications
- Al/SiC Thermal Management Materials
- Understanding of Laser, Laser diodes, Laser diode packaging and its relationship to Tungsten Copper
- Future Trend of Advanced Thermal Management Materials.