Advanced Thermal Management Materials

• Main Authors: Jiang, Guosheng (Author), Diao, Liyong (Author), Kuang, Ken (Author)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic eBook
• Language: English
• Published: New York, NY : Springer New York : Imprint: Springer, 2013.
• Subjects: Energy.; Energy efficiency.; Thermodynamics.; Heat engineering.; Heat transfer.; Mass transfer.; Electronics.; Microelectronics.; Metals.; Energy Efficiency (incl. Buildings).; Electronics and Microelectronics, Instrumentation.; Engineering Thermodynamics, Heat and Mass Transfer.; Metallic Materials.

Advanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This...

Table of Contents:

• Introduction to Thermal Management in Microelectronics Packaging
• Requirements of Thermal Management Materials
• Overview of Traditional Thermal Management Materials.-Development of Advanced Thermal Management Materials
• Properties of WCu, MoCu, Cu/MoCu/Cu High Performance Heat Sink Materials and Manufacturing Technologies
• Novel Methods for Manufacturing of W85-Cu Heat Sinks for Electronic Packaging Applications
•  Improved Manufacturing Process of Cu/Mo70-Cu/Cu Composite Heat Sinks for Electronic Packaging Applications
• Al/SiC Thermal Management Materials
• Understanding of Laser, Laser diodes, Laser diode packaging and its relationship to Tungsten Copper
• Future Trend of Advanced Thermal Management Materials.