APA (7th ed.) Citation

Khan, N., & Hassoun, S. (2013). Designing TSVs for 3D Integrated Circuits. Springer New York : Imprint: Springer.

Chicago Style (17th ed.) Citation

Khan, Nauman, and Soha Hassoun. Designing TSVs for 3D Integrated Circuits. New York, NY: Springer New York : Imprint: Springer, 2013.

MLA (8th ed.) Citation

Khan, Nauman, and Soha Hassoun. Designing TSVs for 3D Integrated Circuits. Springer New York : Imprint: Springer, 2013.