Designing TSVs for 3D Integrated Circuits

Designing TSVs for 3D Integrated Circuits

This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside groun...

Πλήρης περιγραφή

Λεπτομέρειες βιβλιογραφικής εγγραφής
Κύριοι συγγραφείς:	Khan, Nauman (Συγγραφέας), Hassoun, Soha (Συγγραφέας)
Συγγραφή απο Οργανισμό/Αρχή:	SpringerLink (Online service)
Μορφή:	Ηλεκτρονική πηγή Ηλ. βιβλίο
Γλώσσα:	English
Έκδοση:	New York, NY : Springer New York : Imprint: Springer, 2013.
Σειρά:	SpringerBriefs in Electrical and Computer Engineering,
Θέματα:	Engineering. Microprocessors. Electronics. Microelectronics. Electronic circuits. Circuits and Systems. Processor Architectures. Electronics and Microelectronics, Instrumentation.
Διαθέσιμο Online:	Full Text via HEAL-Link

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