Designing TSVs for 3D Integrated Circuits
This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside groun...
| Main Authors: | , |
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| Corporate Author: | |
| Format: | Electronic eBook |
| Language: | English |
| Published: |
New York, NY :
Springer New York : Imprint: Springer,
2013.
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| Series: | SpringerBriefs in Electrical and Computer Engineering,
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| Subjects: | |
| Online Access: | Full Text via HEAL-Link |
