Designing TSVs for 3D Integrated Circuits

• Main Authors: Khan, Nauman (Author), Hassoun, Soha (Author)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic eBook
• Language: English
• Published: New York, NY : Springer New York : Imprint: Springer, 2013.
• Series: SpringerBriefs in Electrical and Computer Engineering,
• Subjects: Engineering.; Microprocessors.; Electronics.; Microelectronics.; Electronic circuits.; Circuits and Systems.; Processor Architectures.; Electronics and Microelectronics, Instrumentation.

This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits.  It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside groun...

Table of Contents:

• Introduction
• Background
• Analysis and Mitigation of TSV-Induced Substrate Noise
• TSVs for Power Delivery
• Early Estimation of TSV Area for Power Delivery in 3-D ICs
• Carbon Nanotubes for Advancing TSV Technology
• Conclusions and Future Directions.