Designing TSVs for 3D Integrated Circuits

• Κύριοι συγγραφείς: Khan, Nauman (Συγγραφέας), Hassoun, Soha (Συγγραφέας)
• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: New York, NY : Springer New York : Imprint: Springer, 2013.
• Σειρά: SpringerBriefs in Electrical and Computer Engineering,
• Θέματα: Engineering.; Microprocessors.; Electronics.; Microelectronics.; Electronic circuits.; Circuits and Systems.; Processor Architectures.; Electronics and Microelectronics, Instrumentation.

This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits.  It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside groun...

Πίνακας περιεχομένων:

• Introduction
• Background
• Analysis and Mitigation of TSV-Induced Substrate Noise
• TSVs for Power Delivery
• Early Estimation of TSV Area for Power Delivery in 3-D ICs
• Carbon Nanotubes for Advancing TSV Technology
• Conclusions and Future Directions.