Copper Wire Bonding

• Κύριοι συγγραφείς: Chauhan, Preeti S. (Συγγραφέας), Choubey, Anupam (Συγγραφέας), Zhong, ZhaoWei (Συγγραφέας), Pecht, Michael G. (Συγγραφέας)
• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: New York, NY : Springer New York : Imprint: Springer, 2014.
• Θέματα: Engineering.; Mechatronics.; Industrial engineering.; Optical materials.; Electronic materials.; Operating Procedures, Materials Treatment.; Optical and Electronic Materials.

This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks.  Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cos...

Πίνακας περιεχομένων:

• Copper Wire Bonding
• Bonding Process
• Bonding Metallurgies
• Wire Bond Evaluation
• Thermal Reliability Tests
• Humidity and Electromigration Tests
• Wire Bond Pads
• Concerns and Solutions
• Recommendations
• Appendix A: Reliability Data
• Appendix B: Patents on Copper Wire Bonding.