Copper Electrodeposition for Nanofabrication of Electronics Devices

• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Άλλοι συγγραφείς: Kondo, Kazuo (Επιμελητής έκδοσης), Akolkar, Rohan N. (Επιμελητής έκδοσης), Barkey, Dale P. (Επιμελητής έκδοσης), Yokoi, Masayuki (Επιμελητής έκδοσης)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: New York, NY : Springer New York : Imprint: Springer, 2014.
• Σειρά: Nanostructure Science and Technology,
• Θέματα: Chemistry.; Electrochemistry.; Solid state physics.; Electronics.; Microelectronics.; Nanotechnology.; Electronics and Microelectronics, Instrumentation.; Solid State Physics.
• Φυσική περιγραφή: VIII, 282 p. 190 illus., 75 illus. in color. online resource.
• ISBN: 9781461491767
• ISSN: 1571-5744

This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon copper nanowiring • Printed circuit boards • Stacked semiconductors • Through Silicon Via • Smooth copper foil for Lithium-Ion battery electrodes This book is ideal for nanotechnologists, industry professionals, and practitioners.