Copper Electrodeposition for Nanofabrication of Electronics Devices

This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon c...

Πλήρης περιγραφή

Λεπτομέρειες βιβλιογραφικής εγγραφής
Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
Άλλοι συγγραφείς: Kondo, Kazuo (Επιμελητής έκδοσης), Akolkar, Rohan N. (Επιμελητής έκδοσης), Barkey, Dale P. (Επιμελητής έκδοσης), Yokoi, Masayuki (Επιμελητής έκδοσης)
Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
Γλώσσα:English
Έκδοση: New York, NY : Springer New York : Imprint: Springer, 2014.
Σειρά:Nanostructure Science and Technology,
Θέματα:
Διαθέσιμο Online:Full Text via HEAL-Link
LEADER 02928nam a22005535i 4500
001 978-1-4614-9176-7
003 DE-He213
005 20151028132036.0
007 cr nn 008mamaa
008 131120s2014 xxu| s |||| 0|eng d
020 |a 9781461491767  |9 978-1-4614-9176-7 
024 7 |a 10.1007/978-1-4614-9176-7  |2 doi 
040 |d GrThAP 
050 4 |a QD551-578 
072 7 |a PNRH  |2 bicssc 
072 7 |a SCI013050  |2 bisacsh 
082 0 4 |a 541.37  |2 23 
245 1 0 |a Copper Electrodeposition for Nanofabrication of Electronics Devices  |h [electronic resource] /  |c edited by Kazuo Kondo, Rohan N. Akolkar, Dale P. Barkey, Masayuki Yokoi. 
264 1 |a New York, NY :  |b Springer New York :  |b Imprint: Springer,  |c 2014. 
300 |a VIII, 282 p. 190 illus., 75 illus. in color.  |b online resource. 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
347 |a text file  |b PDF  |2 rda 
490 1 |a Nanostructure Science and Technology,  |x 1571-5744 
505 0 |a Copper Electrodeposition -- Suppression Effect and Additive Chemistry -- Acceleration Effect -- Modeling and Simulation -- Frontiers of Cu Electrodeposition and Electroless Plating for On-Chip Interconnects -- Microstructure of Evolution of Copper in Nano-scale Interconnect Features -- Direct Copper Plating -- Through Silicon Via -- Build-up Printed Wiring Boards -- Copper Foil Smooth on Both Sides for Lithium Ion Battery -- Through Hole Plating. 
520 |a This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon copper nanowiring • Printed circuit boards • Stacked semiconductors • Through Silicon Via • Smooth copper foil for Lithium-Ion battery electrodes This book is ideal for nanotechnologists, industry professionals, and practitioners. 
650 0 |a Chemistry. 
650 0 |a Electrochemistry. 
650 0 |a Solid state physics. 
650 0 |a Electronics. 
650 0 |a Microelectronics. 
650 0 |a Nanotechnology. 
650 1 4 |a Chemistry. 
650 2 4 |a Electrochemistry. 
650 2 4 |a Nanotechnology. 
650 2 4 |a Electronics and Microelectronics, Instrumentation. 
650 2 4 |a Solid State Physics. 
700 1 |a Kondo, Kazuo.  |e editor. 
700 1 |a Akolkar, Rohan N.  |e editor. 
700 1 |a Barkey, Dale P.  |e editor. 
700 1 |a Yokoi, Masayuki.  |e editor. 
710 2 |a SpringerLink (Online service) 
773 0 |t Springer eBooks 
776 0 8 |i Printed edition:  |z 9781461491750 
830 0 |a Nanostructure Science and Technology,  |x 1571-5744 
856 4 0 |u http://dx.doi.org/10.1007/978-1-4614-9176-7  |z Full Text via HEAL-Link 
912 |a ZDB-2-CMS 
950 |a Chemistry and Materials Science (Springer-11644)