Copper Electrodeposition for Nanofabrication of Electronics Devices
This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon c...
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Bibliographic Details
| Corporate Author: |
SpringerLink (Online service) |
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| Other Authors: |
Kondo, Kazuo
(Editor),
Akolkar, Rohan N.
(Editor),
Barkey, Dale P.
(Editor),
Yokoi, Masayuki
(Editor) |
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| Format: | Electronic
eBook
|
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| Language: | English |
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| Published: |
New York, NY :
Springer New York : Imprint: Springer,
2014.
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| Series: | Nanostructure Science and Technology,
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| Subjects: | |
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| Online Access: | Full Text via HEAL-Link
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