Copper Electrodeposition for Nanofabrication of Electronics Devices

• Corporate Author: SpringerLink (Online service)
• Other Authors: Kondo, Kazuo (Editor), Akolkar, Rohan N. (Editor), Barkey, Dale P. (Editor), Yokoi, Masayuki (Editor)
• Format: Electronic eBook
• Language: English
• Published: New York, NY : Springer New York : Imprint: Springer, 2014.
• Series: Nanostructure Science and Technology,
• Subjects: Chemistry.; Electrochemistry.; Solid state physics.; Electronics.; Microelectronics.; Nanotechnology.; Electronics and Microelectronics, Instrumentation.; Solid State Physics.

This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon c...