Copper Electrodeposition for Nanofabrication of Electronics Devices

• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Άλλοι συγγραφείς: Kondo, Kazuo (Επιμελητής έκδοσης), Akolkar, Rohan N. (Επιμελητής έκδοσης), Barkey, Dale P. (Επιμελητής έκδοσης), Yokoi, Masayuki (Επιμελητής έκδοσης)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: New York, NY : Springer New York : Imprint: Springer, 2014.
• Σειρά: Nanostructure Science and Technology,
• Θέματα: Chemistry.; Electrochemistry.; Solid state physics.; Electronics.; Microelectronics.; Nanotechnology.; Electronics and Microelectronics, Instrumentation.; Solid State Physics.

This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon c...

Πίνακας περιεχομένων:

• Copper Electrodeposition
• Suppression Effect and Additive Chemistry
• Acceleration Effect
• Modeling and Simulation
• Frontiers of Cu Electrodeposition and Electroless Plating for On-Chip Interconnects
• Microstructure of Evolution of Copper in Nano-scale Interconnect Features
• Direct Copper Plating
• Through Silicon Via
• Build-up Printed Wiring Boards
• Copper Foil Smooth on Both Sides for Lithium Ion Battery
• Through Hole Plating.