Packaging of High Power Semiconductor Lasers

Packaging of High Power Semiconductor Lasers

This book introduces high power semiconductor laser packaging design.  The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors.  New technologies, in particular thermal technologies, current applications, and trends in hi...

Full description

Bibliographic Details
Main Authors: Liu, Xingsheng (Author), Zhao, Wei (Author), Xiong, Lingling (Author), Liu, Hui (Author)
Corporate Author: SpringerLink (Online service)
Format: Electronic eBook
Language:English
Published: New York, NY : Springer New York : Imprint: Springer, 2015.
Series:Micro- and Opto-Electronic Materials, Structures, and Systems
Subjects:
Energy.
Energy systems.
Energy Systems.
Online Access:Full Text via HEAL-Link
Description
Summary:This book introduces high power semiconductor laser packaging design.  The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors.  New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.
Physical Description:XV, 402 p. 497 illus., 386 illus. in color. online resource.
ISBN:9781461492634

Similar Items