Packaging of High Power Semiconductor Lasers
This book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors. New technologies, in particular thermal technologies, current applications, and trends in hi...
Κύριοι συγγραφείς: | Liu, Xingsheng (Συγγραφέας), Zhao, Wei (Συγγραφέας), Xiong, Lingling (Συγγραφέας), Liu, Hui (Συγγραφέας) |
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Συγγραφή απο Οργανισμό/Αρχή: | SpringerLink (Online service) |
Μορφή: | Ηλεκτρονική πηγή Ηλ. βιβλίο |
Γλώσσα: | English |
Έκδοση: |
New York, NY :
Springer New York : Imprint: Springer,
2015.
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Σειρά: | Micro- and Opto-Electronic Materials, Structures, and Systems
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Θέματα: | |
Διαθέσιμο Online: | Full Text via HEAL-Link |
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