Packaging of High Power Semiconductor Lasers
This book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors. New technologies, in particular thermal technologies, current applications, and trends in hi...
| Κύριοι συγγραφείς: | , , , |
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| Συγγραφή απο Οργανισμό/Αρχή: | |
| Μορφή: | Ηλεκτρονική πηγή Ηλ. βιβλίο |
| Γλώσσα: | English |
| Έκδοση: |
New York, NY :
Springer New York : Imprint: Springer,
2015.
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| Σειρά: | Micro- and Opto-Electronic Materials, Structures, and Systems
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| Θέματα: | |
| Διαθέσιμο Online: | Full Text via HEAL-Link |
Πίνακας περιεχομένων:
- Introduction of High Power Semiconductor Lasers
- Overview of High Power Semiconductor Laser Packages
- Thermal Design and Management in High Power Semiconductor Laser Packaging
- Thermal Stress in High Power Semiconductor Lasers
- Optical Design and Beam Shaping in High Power Semiconductor Lasers
- Materials and Components in High Power Semiconductor Laser Packaging
- Packaging Process of High Power Semiconductor Lasers
- Testing and Characterization of High Power Semiconductor Lasers
- Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging
- Applications of High Power Semiconductor Lasers
- Development Trend and Challenges in High Power Semiconductor Laser Packaging.
