Παραπομπή σε μορφή APA (7η εκδ.)

Lee, T., Bieler, T. R., Kim, C., & Ma, H. (2015). Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability. Springer US : Imprint: Springer.

Παραπομπή σε μορφή Chicago (17η εκδ.)

Lee, Tae-Kyu, Thomas R. Bieler, Choong-Un Kim, και Hongtao Ma. Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability. Boston, MA: Springer US : Imprint: Springer, 2015.

Παραπομπή σε μορφή MLA (8th εκδ.)

Lee, Tae-Kyu, et al. Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability. Springer US : Imprint: Springer, 2015.