APA (7th ed.) Citation

Lee, T., Bieler, T. R., Kim, C., & Ma, H. (2015). Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability. Springer US : Imprint: Springer.

Chicago Style (17th ed.) Citation

Lee, Tae-Kyu, Thomas R. Bieler, Choong-Un Kim, and Hongtao Ma. Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability. Boston, MA: Springer US : Imprint: Springer, 2015.

MLA (8th ed.) Citation

Lee, Tae-Kyu, et al. Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability. Springer US : Imprint: Springer, 2015.