Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability /

• Κύριοι συγγραφείς: Lee, Tae-Kyu (Συγγραφέας), Bieler, Thomas R. (Συγγραφέας), Kim, Choong-Un (Συγγραφέας), Ma, Hongtao (Συγγραφέας)
• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Boston, MA : Springer US : Imprint: Springer, 2015.
• Θέματα: Engineering.; Electronics.; Microelectronics.; Electronic circuits.; Optical materials.; Electronic materials.; Electronics and Microelectronics, Instrumentation.; Optical and Electronic Materials.; Circuits and Systems.

This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable r...

Πίνακας περιεχομένων:

• Introduction
• Interconnection : The Joint
• Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys
• Microstructure Development; Solidification and Isothermal Aging
• Thermal Cycling Performance
• Mechanical Stability and Performance
• Chemical and Environment Attack
• Challenges in Future Generation Interconnects: Microstructure Again.