APA (7th ed.) Citation

Qu, S., & Liu, Y. (2015). Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications. Springer New York : Imprint: Springer.

Chicago Style (17th ed.) Citation

Qu, Shichun, and Yong Liu. Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications. New York, NY: Springer New York : Imprint: Springer, 2015.

MLA (8th ed.) Citation

Qu, Shichun, and Yong Liu. Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications. Springer New York : Imprint: Springer, 2015.