Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications /

• Main Authors: Qu, Shichun (Author), Liu, Yong (Author)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic eBook
• Language: English
• Published: New York, NY : Springer New York : Imprint: Springer, 2015.
• Subjects: Engineering.; Thermodynamics.; Heat engineering.; Heat transfer.; Mass transfer.; Electronics.; Microelectronics.; Electronic circuits.; Electronics and Microelectronics, Instrumentation.; Circuits and Systems.; Engineering Thermodynamics, Heat and Mass Transfer.

This book presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability, and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The...