Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications /

• Κύριοι συγγραφείς: Qu, Shichun (Συγγραφέας), Liu, Yong (Συγγραφέας)
• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: New York, NY : Springer New York : Imprint: Springer, 2015.
• Θέματα: Engineering.; Thermodynamics.; Heat engineering.; Heat transfer.; Mass transfer.; Electronics.; Microelectronics.; Electronic circuits.; Electronics and Microelectronics, Instrumentation.; Circuits and Systems.; Engineering Thermodynamics, Heat and Mass Transfer.

This book presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability, and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The...

Πίνακας περιεχομένων:

• Chapter 1. Demand and Challenges for Wafer Level Analog and Power Packaging
• Chapter 2. Fan-In Analog Wafer Level Chip Scale Package
• Chapter 3. Fan-Out Analog Wafer Level Chip Scale Package
• Chapter 4. Wafer Level Analog Chip Scale Package Stackable Design
• Chapter 5. Wafer Level Discrete Power MOSFET Package Design
• Chapter 6. Wafer Level Packaging TSV/Stack die for Integration of Analog and Power Solution
• Chapter 7. Thermal Management, Design, Analysis for WLCSP
• Chapter 8. Electrical and Multi-Physics Simulations for Analog and Power WLCSP
• Chapter 9. WLCSP Typical Assembly Process
• Chapter 10. WLCSP Typical Reliability and Test.