More than Moore Technologies for Next Generation Computer Design

This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance.  Authors discuss in detail what are known commonly as “More than Moore” (MtM), technologie...

Πλήρης περιγραφή

Λεπτομέρειες βιβλιογραφικής εγγραφής
Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
Άλλοι συγγραφείς: Topaloglu, Rasit O. (Επιμελητής έκδοσης)
Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
Γλώσσα:English
Έκδοση: New York, NY : Springer New York : Imprint: Springer, 2015.
Θέματα:
Διαθέσιμο Online:Full Text via HEAL-Link
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245 1 0 |a More than Moore Technologies for Next Generation Computer Design  |h [electronic resource] /  |c edited by Rasit O. Topaloglu. 
264 1 |a New York, NY :  |b Springer New York :  |b Imprint: Springer,  |c 2015. 
300 |a IX, 218 p. 116 illus., 63 illus. in color.  |b online resource. 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
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505 0 |a Impact of TSV and Device Scaling on the Quality of 3D Ics -- 3D Integration Technology -- Design and Optimization of Spin-Transfer Torque MRAMs -- Embedded STT-MRAM: Device and Design -- A Thermal and Process Variation Aware MTJ Switching Model and Its Applications in Soft Error Analysis -- Nano-Photonic Networks-on-Chip for Future Chip Multiprocessors -- Design Automation for On-chip Nanophotonic Integration. 
520 |a This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance.  Authors discuss in detail what are known commonly as “More than Moore” (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to “Moore's Law”.  Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect. 
650 0 |a Engineering. 
650 0 |a Microprocessors. 
650 0 |a Electronics. 
650 0 |a Microelectronics. 
650 0 |a Electronic circuits. 
650 1 4 |a Engineering. 
650 2 4 |a Circuits and Systems. 
650 2 4 |a Electronics and Microelectronics, Instrumentation. 
650 2 4 |a Processor Architectures. 
700 1 |a Topaloglu, Rasit O.  |e editor. 
710 2 |a SpringerLink (Online service) 
773 0 |t Springer eBooks 
776 0 8 |i Printed edition:  |z 9781493921621 
856 4 0 |u http://dx.doi.org/10.1007/978-1-4939-2163-8  |z Full Text via HEAL-Link 
912 |a ZDB-2-ENG 
950 |a Engineering (Springer-11647)