Silver Metallization Stability and Reliability /

Silver has the lowest resistivity of all metals, which makes it an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address the thermal and electrical stability, as well...

Πλήρης περιγραφή

Λεπτομέρειες βιβλιογραφικής εγγραφής
Κύριοι συγγραφείς: Adams, Daniel (Συγγραφέας), Alford, Terry L. (Συγγραφέας), Mayer, James W. (Συγγραφέας)
Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
Γλώσσα:English
Έκδοση: London : Springer London, 2008.
Σειρά:Engineering Materials and Processes,
Θέματα:
Διαθέσιμο Online:Full Text via HEAL-Link
LEADER 03869nam a22006015i 4500
001 978-1-84800-027-8
003 DE-He213
005 20151204142442.0
007 cr nn 008mamaa
008 100301s2008 xxk| s |||| 0|eng d
020 |a 9781848000278  |9 978-1-84800-027-8 
024 7 |a 10.1007/978-1-84800-027-8  |2 doi 
040 |d GrThAP 
050 4 |a QC176.8.S8 
050 4 |a QC611.6.S9 
050 4 |a QC176.84.S93 
072 7 |a PHFC  |2 bicssc 
072 7 |a SCI077000  |2 bisacsh 
082 0 4 |a 530.417  |2 23 
100 1 |a Adams, Daniel.  |e author. 
245 1 0 |a Silver Metallization  |h [electronic resource] :  |b Stability and Reliability /  |c by Daniel Adams, Terry L. Alford, James W. Mayer. 
264 1 |a London :  |b Springer London,  |c 2008. 
300 |a XII, 123 p. 66 illus.  |b online resource. 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
347 |a text file  |b PDF  |2 rda 
490 1 |a Engineering Materials and Processes,  |x 1619-0181 
505 0 |a Silver Thin Film Characterization -- Diffusion Barriers and Self-encapsulation -- Thermal Stability -- Silver Electromigration Resistance -- Integration Issues -- Summary. 
520 |a Silver has the lowest resistivity of all metals, which makes it an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address the thermal and electrical stability, as well as processing issues which, to date, have prevented the implementation of silver as an interconnect metal. Silver Metallization: Stability and Reliability is the first book to discuss current knowledge of silver metallization and its potential as a favorable candidate for implementation as a future interconnect material for integrated circuit technology. Silver Metallization: Stability and Reliability provides detailed information on a wide range of experimental, characterization and analysis techniques. It also presents the novel approaches used to overcome the thermal and electrical stability issues associated with silver metallization. Readers will learn about the: preparation and characterization of elemental silver thin films and silver-metal alloys; formation of diffusion barriers and adhesion promoters; evaluation of the thermal stability of silver under different annealing conditions; evaluation of the electrical properties of silver thin films under various processing conditions; methods of dry etching of silver lines and the integration of silver with low-k dielectric materials. As a valuable resource in this emerging field; Silver Metallization: Stability and Reliability will be very useful to students, scientists, engineers and technologists in the fields of integrated circuits and microelectronics research and development. 
650 0 |a Physics. 
650 0 |a Surfaces (Physics). 
650 0 |a Interfaces (Physical sciences). 
650 0 |a Thin films. 
650 0 |a Industrial engineering. 
650 0 |a Production engineering. 
650 0 |a Metals. 
650 0 |a Materials  |x Surfaces. 
650 1 4 |a Physics. 
650 2 4 |a Surface and Interface Science, Thin Films. 
650 2 4 |a Industrial and Production Engineering. 
650 2 4 |a Metallic Materials. 
650 2 4 |a Surfaces and Interfaces, Thin Films. 
650 2 4 |a Operating Procedures, Materials Treatment. 
700 1 |a Alford, Terry L.  |e author. 
700 1 |a Mayer, James W.  |e author. 
710 2 |a SpringerLink (Online service) 
773 0 |t Springer eBooks 
776 0 8 |i Printed edition:  |z 9781848000261 
830 0 |a Engineering Materials and Processes,  |x 1619-0181 
856 4 0 |u http://dx.doi.org/10.1007/978-1-84800-027-8  |z Full Text via HEAL-Link 
912 |a ZDB-2-CMS 
950 |a Chemistry and Materials Science (Springer-11644)