Silver Metallization Stability and Reliability /

• Main Authors: Adams, Daniel (Author), Alford, Terry L. (Author), Mayer, James W. (Author)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic eBook
• Language: English
• Published: London : Springer London, 2008.
• Series: Engineering Materials and Processes,
• Subjects: Physics.; Surfaces (Physics).; Interfaces (Physical sciences).; Thin films.; Industrial engineering.; Production engineering.; Metals.; Materials > Surfaces.; Surface and Interface Science, Thin Films.; Industrial and Production Engineering.; Metallic Materials.; Surfaces and Interfaces, Thin Films.; Operating Procedures, Materials Treatment.

Silver has the lowest resistivity of all metals, which makes it an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address the thermal and electrical stability, as well...

Table of Contents:

• Silver Thin Film Characterization
• Diffusion Barriers and Self-encapsulation
• Thermal Stability
• Silver Electromigration Resistance
• Integration Issues
• Summary.