Product Lifecycle Management to Support Industry 4.0 15th IFIP WG 5.1 International Conference, PLM 2018, Turin, Italy, July 2-4, 2018, Proceedings /

• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Άλλοι συγγραφείς: Chiabert, Paolo (Επιμελητής έκδοσης, http://id.loc.gov/vocabulary/relators/edt), Bouras, Abdelaziz (Επιμελητής έκδοσης, http://id.loc.gov/vocabulary/relators/edt), Noël, Frédéric (Επιμελητής έκδοσης, http://id.loc.gov/vocabulary/relators/edt), Ríos, José (Επιμελητής έκδοσης, http://id.loc.gov/vocabulary/relators/edt)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Cham : Springer International Publishing : Imprint: Springer, 2018.
• Έκδοση: 1st ed. 2018.
• Σειρά: IFIP Advances in Information and Communication Technology, 540
• Θέματα: Management information systems.; Computer science.; Application software.; Software engineering.; Education-Data processing.; Artificial intelligence.; Mathematical logic.; Management of Computing and Information Systems.; Information Systems Applications (incl. Internet).; Software Engineering.; Computers and Education.; Artificial Intelligence.; Mathematical Logic and Formal Languages.
• Φυσική περιγραφή: XVIII, 803 p. 299 illus., 241 illus. in color. online resource.
• ISBN: 9783030016142
• ISSN: 1868-4238 ;
• DOI: 10.1007/978-3-030-01614-2

This book constitutes the refereed post-conference proceedings of the 15th IFIP WG 5.1 International Conference on Product Lifecycle Management, PLM 2018, held in Turin, Spain, in July 2018. The 72 revised full papers presented were carefully reviewed and selected from 82 submissions. The papers are organized in the following topical sections: building information modeling; collaborative environments and new product development; PLM for digital factories and cyber physical systems; ontologies and data models; education in the field of industry 4.0; product-service systems and smart products; lean organization for industry 4.0; knowledge management and information sharing; PLM infrastructure and implementation; PLM maturity, implementation and adoption; 3D printing and additive manufacturing; and modular design and products and configuration and change management.