Systems-Level Packaging for Millimeter-Wave Transceivers

• Main Authors: Božanić, Mladen (Author, http://id.loc.gov/vocabulary/relators/aut), Sinha, Saurabh (http://id.loc.gov/vocabulary/relators/aut)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic eBook
• Language: English
• Published: Cham : Springer International Publishing : Imprint: Springer, 2019.
• Edition: 1st ed. 2019.
• Series: Smart Sensors, Measurement and Instrumentation, 34
• Subjects: Wireless communication systems.; Mobile communication systems.; Engineering design.; Computer engineering.; Internet of things.; Embedded computer systems.; Wireless and Mobile Communication.; Engineering Design.; Cyber-physical systems, IoT.

This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able...

Table of Contents:

• Introduction and Research Impact
• Millimeter-Wave Research Challenges.-Behavior of Active and Passive Devices at Millimeter-Wave Frequencies
• Integrated Substrates: Millimeter-Wave Transistor Technologies
• Discrete Substrates: Package Foundation
• Traditional Approach: System-on-Chip
• Multi-Chip Modules and Multi-Chip Packaging
• State-of-the-Art Approach: System-on-Package
• Evaluation of Research Questions, Remaining Research Gaps and Future Directions.