Particles in Contact Micro Mechanics, Micro Process Dynamics and Particle Collective /

• Corporate Author: SpringerLink (Online service)
• Other Authors: Antonyuk, Sergiy (Editor, http://id.loc.gov/vocabulary/relators/edt)
• Format: Electronic eBook
• Language: English
• Published: Cham : Springer International Publishing : Imprint: Springer, 2019.
• Edition: 1st ed. 2019.
• Subjects: Materials-Surfaces.; Thin films.; Optics.; Electrodynamics.; Engineering-Materials.; Surfaces and Interfaces, Thin Films.; Classical Electrodynamics.; Materials Engineering.

This book contains the latest scientific findings in the area of granular materials, their physical fundamentals and applications in particle technology focused on the description of interactions of fine adhesive particles. In collaboration between physicists, chemists, mathematicians and mechanics...

Table of Contents:

• From the content: Analysis of adsorbates and interfacial forces at metal oxide interfaces at defined environmental conditions
• Microwave emission during the impact compaction of particle bed
• Formation, deformation, rolling and sliding of particles and particle aggregates: Mechanisms and applications
• Formation, deformation, rolling and sliding of particles and particle aggregates: Mechanisms and applications
• Contact models and DEM simulation of micrometer-sized particles and agglomerates at static loading based on experimental characterization
• Contact mechanisms in ultrasound-agitated particulate systems
• Capillary interaction in wet granular assemblies.