Solder Joint Reliability Assessment Finite Element Simulation Methodology /
This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover...
| Main Authors: | , |
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| Corporate Author: | |
| Format: | Electronic eBook |
| Language: | English |
| Published: |
Cham :
Springer International Publishing : Imprint: Springer,
2014.
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| Series: | Advanced Structured Materials,
37 |
| Subjects: | |
| Online Access: | Full Text via HEAL-Link |
Internet
Full Text via HEAL-LinkΒΚΠ - Πατρα: ALFd
| Call Number: |
330.01 BAU |
|---|---|
| Copy 1 | Available |
ΒΚΠ - Πατρα: BSC
| Call Number: |
330.01 BAU |
|---|---|
| Copy 2 | Available |
| Copy 3 | Available |