Solder Joint Reliability Assessment Finite Element Simulation Methodology /

• Κύριοι συγγραφείς: Tamin, Mohd N. (Συγγραφέας), Shaffiar, Norhashimah M. (Συγγραφέας)
• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Cham : Springer International Publishing : Imprint: Springer, 2014.
• Σειρά: Advanced Structured Materials, 37
• Θέματα: Materials science.; Continuum mechanics.; Quality control.; Reliability.; Industrial safety.; Materials Science.; Characterization and Evaluation of Materials.; Continuum Mechanics and Mechanics of Materials.; Quality Control, Reliability, Safety and Risk.

This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover...

Πίνακας περιεχομένων:

• Introduction
• Overview of the Simulation Methodology
• Requirements for Finite Element Simulation
• Mechanics of Solder Materials
• Application I: Solder Joint Reflow Process
• Application II: Solder Joints under Temperature and Mechanical Cycles
• Damage Mechanics-based Models
• Application III: Board-level Drop Test with BGA Package
• Fatigue Fracture Process of Solder Joints
• Closure.