Solder Joint Reliability Assessment Finite Element Simulation Methodology /

This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover...

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Bibliographic Details
Main Authors: Tamin, Mohd N. (Author), Shaffiar, Norhashimah M. (Author)
Corporate Author: SpringerLink (Online service)
Format: Electronic eBook
Language:English
Published: Cham : Springer International Publishing : Imprint: Springer, 2014.
Series:Advanced Structured Materials, 37
Subjects:
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ΒΚΠ - Πατρα: ALFd

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Call Number: 330.01 BAU
Copy 1 Available

ΒΚΠ - Πατρα: BSC

Holdings details from ΒΚΠ - Πατρα: BSC
Call Number: 330.01 BAU
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