Factors Governing Tin Whisker Growth

• Κύριος συγγραφέας: Crandall, Erika R. (Συγγραφέας)
• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Cham : Springer International Publishing : Imprint: Springer, 2013.
• Σειρά: Springer Theses, Recognizing Outstanding Ph.D. Research,
• Θέματα: Physics.; Surfaces (Physics).; Interfaces (Physical sciences).; Thin films.; Electronic circuits.; Metals.; Materials > Surfaces.; Electronic Circuits and Devices.; Circuits and Systems.; Metallic Materials.; Surfaces and Interfaces, Thin Films.; Surface and Interface Science, Thin Films.

Tin (Sn) whiskers are electrically conductive, single crystal eruptions that grow from Sn film surfaces. Their high aspect ratio presents reliability problems for the electronics industry due to bridging and metal arcing, leading to malfunctions and catastrophic failures in many electronic systems (...

Πίνακας περιεχομένων:

• Whiskers and Their Role in Component Reliability
• Film/Substrate Effects on Whisker Growth
• Environmental Effects of Whisker Growth
• Whisker Mitigation and Prevention
• Conclusions.