MEMS and Nanotechnology, Volume 5 Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics /

MEMS and Nanotechnology, Volume 5: Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics, the fifth volume of eight from the Conference, brings together contributions to this important area of research and engineering.  The collection presents early findings and case studie...

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Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
Άλλοι συγγραφείς: Shaw III, Gordon (Επιμελητής έκδοσης), Prorok, Barton C. (Επιμελητής έκδοσης), Starman, LaVern (Επιμελητής έκδοσης), Furlong, Cosme (Επιμελητής έκδοσης)
Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
Γλώσσα:English
Έκδοση: Cham : Springer International Publishing : Imprint: Springer, 2014.
Σειρά:Conference Proceedings of the Society for Experimental Mechanics Series,
Θέματα:
Διαθέσιμο Online:Full Text via HEAL-Link
LEADER 03056nam a22005175i 4500
001 978-3-319-00780-9
003 DE-He213
005 20151204162854.0
007 cr nn 008mamaa
008 130917s2014 gw | s |||| 0|eng d
020 |a 9783319007809  |9 978-3-319-00780-9 
024 7 |a 10.1007/978-3-319-00780-9  |2 doi 
040 |d GrThAP 
050 4 |a T174.7 
072 7 |a TDPB  |2 bicssc 
072 7 |a TEC027000  |2 bisacsh 
082 0 4 |a 620.5  |2 23 
245 1 0 |a MEMS and Nanotechnology, Volume 5  |h [electronic resource] :  |b Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics /  |c edited by Gordon Shaw III, Barton C. Prorok, LaVern Starman, Cosme Furlong. 
264 1 |a Cham :  |b Springer International Publishing :  |b Imprint: Springer,  |c 2014. 
300 |a VIII, 134 p. 124 illus.  |b online resource. 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
347 |a text file  |b PDF  |2 rda 
490 1 |a Conference Proceedings of the Society for Experimental Mechanics Series,  |x 2191-5644 
505 0 |a From the Contents: Warpage Measurement of Simulated Electronic Packaging Assembly -- Nanomechanical Characterization of Lead Free Solder Joints -- In-Situ Surface Mount Process Characterization Using Digital Image Correlation -- Acoustic Waveform Energy as an Interconnect Damage Indicator -- Shape Optimization of Cantilevered Piezoelectric Devices -- Unique Fabrication Method for Novel MEMS Micro-contact Structure -- A Frequency Selective Surface Design Fabricated With Tunable RF Meta-atoms -- Stress Characterization in Si/SiO2 Spherical Shells Used in Micro-Robotics. 
520 |a MEMS and Nanotechnology, Volume 5: Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics, the fifth volume of eight from the Conference, brings together contributions to this important area of research and engineering.  The collection presents early findings and case studies on a wide range of areas, including:   Microelectronics Packaging Single Atom/Molecule Mechanical Testing MEMS Devices & Fabrication In-Situ Mechanical Testing Nanoindentation Experimental Analysis of Low-Dimensional Materials for Nanotechnology. 
650 0 |a Engineering. 
650 0 |a Mechanics. 
650 0 |a Mechanics, Applied. 
650 0 |a Nanotechnology. 
650 1 4 |a Engineering. 
650 2 4 |a Nanotechnology and Microengineering. 
650 2 4 |a Theoretical and Applied Mechanics. 
650 2 4 |a Nanotechnology. 
700 1 |a Shaw III, Gordon.  |e editor. 
700 1 |a Prorok, Barton C.  |e editor. 
700 1 |a Starman, LaVern.  |e editor. 
700 1 |a Furlong, Cosme.  |e editor. 
710 2 |a SpringerLink (Online service) 
773 0 |t Springer eBooks 
776 0 8 |i Printed edition:  |z 9783319007793 
830 0 |a Conference Proceedings of the Society for Experimental Mechanics Series,  |x 2191-5644 
856 4 0 |u http://dx.doi.org/10.1007/978-3-319-00780-9  |z Full Text via HEAL-Link 
912 |a ZDB-2-ENG 
950 |a Engineering (Springer-11647)