Residual Stress, Thermomechanics & Infrared Imaging, Hybrid Techniques and Inverse Problems, Volume 8 Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics /

• Corporate Author: SpringerLink (Online service)
• Other Authors: Rossi, Marco (Editor), Sasso, Marco (Editor), Connesson, Nathanael (Editor), Singh, Raman (Editor), DeWald, Adrian (Editor), Backman, David (Editor), Gloeckner, Paul (Editor)
• Format: Electronic eBook
• Language: English
• Published: Cham : Springer International Publishing : Imprint: Springer, 2014.
• Series: Conference Proceedings of the Society for Experimental Mechanics Series,
• Subjects: Engineering.; Thermodynamics.; Heat engineering.; Heat transfer.; Mass transfer.; Continuum mechanics.; Mechanical engineering.; Mechanical Engineering.; Engineering Thermodynamics, Heat and Mass Transfer.; Continuum Mechanics and Mechanics of Materials.

This critical collection presents early findings and case studies on a wide range of areas, as presented in  the Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics. The collection includes papers in the following general technical research areas: • Advances in Residual S...

Table of Contents:

• From the Contents: Analysis of Thrust Production in Small Synthetic Flapping Wings
• Coarse-resolution Cone-beam Scanning of Logs Using Eulerian  CT Reconstruction.  Part I: Discretization and Algorithm
• Coarse-resolution Cone-beam Scanning of Logs Using Eulerian  CT Reconstruction.  Part II: Hardware Design and Demonstration
• Crack Nucleation Threshold Under Fretting Loading by a Thermal Method
• Crack Growth Study of Fibre Metal Laminates Using Thermoelastic Stress Analysis
• Crack Detection in Large Welded Components Under Fatigue Using TSA
• Hybrid Thermoelastic Analysis of an Unsymmetrically-loaded Structure containing an Arbitrarily-shaped Cutout
• Quantitative Themographic Characterization of Composites
• Thermal Deformation of Micro-structure Diffuser Plate in LED Backlight Unit
• Polariscopy Measurement of Residual Stress in Thin Silicon Wafers.